UFP Technologies to Exhibit Molded Fiber Packaging at Pack Expo International

Clinton, IA, August 01, 2012. UFP Technologies is excited to announce that it will be exhibiting at Pack Expo International 2012 from October 28-31 in Chicago, IL. Pack Expo is a global leader in showcasing the "best of the best" and the latest innovations in the world of packaging and processing. Pack Expo is the world's largest packaging event, with more exhibitors from more countries than any other show. Pack Expo offers integrated processing and packaging solutions, breakthrough technology, on-site demonstrations and revolutionary product launches, all of which emphasize innovation and new possibilities for the future of packaging. For four full days, Pack Expo International 2012 will bring together more than 46,000 buyers and 1,800 suppliers from across the globe.

UFP Technologies will be proudly showcasing its molded fiber (pulp) packaging solutions at Pack Expo International 2012. Molded fiber is a 100% recycled and 100% recyclable material made solely of newspaper and water. UFP Technologies has designed and manufactured molded fiber packaging for more than twenty years. Perhaps best recognized by its traditional use as the egg-carton material, molded fiber is now viewed as a viable packaging material that is quickly gaining popularity thanks to its sustainable nature. Molded fiber can be formed into robust packaging to provide blocking and bracing for products, is cost effective, and is environmentally friendly. In the past, UFP Technologies has used its advanced manufacturing capabilities and patented design process to transform molded fiber into countless applications including retail packaging solutions for electronics, health & beauty products, medical instruments and other consumer goods. We welcome you to join us at booth E-7861.

October 28-31, 2012

McCormick Place

Chicago, Illinois USA

Visit Us at
Booth 7861

Register for free