October 8, 2018 – Newburyport, Massachusetts – UFP Technologies, a producer of innovative, custom-engineered molded fiber packaging solutions, will be exhibiting at Pack Expo International in Chicago, IL from October 14-17 at Booth E-7752.
UFP Technologies will display a variety of packaging solutions made from 100% recycled paper. Our advanced manufacturing capabilities and patented design process allows us to produce packaging for a wide range of large, heavy and fragile products including:
Our cost effective and environmentally friendly solutions reduce labor and save space versus other materials while providing superior protection during shipping and storage. For more information about our molded fiber solutions visit moldedfiber.com.
Pack Expo is a leading processing and packaging event showcasing the latest developments in packaging machinery, converting machinery, materials, packages, containers and components
Click here to register. Use code 67C23 to receive free expo admission!
About UFP Technologies
UFP Technologies, Inc. (NASDAQ: UFPT) is a producer of innovative, custom-engineered components, specialty packaging, and products. Using foams, plastics, composites, and natural fiber materials, we design and manufacture a vast range of solutions primarily for the medical, automotive, aerospace, defense, electronics, consumer, and industrial markets. Our team acts as an extension of our customers’ in-house research, engineering and manufacturing groups, working closely with them to solve their most complex product and packaging challenges. For our customers, innovation takes many shapes. But each solution is shaped by a level of design, materials and process expertise that is unique to UFP Technologies.