Innovative packaging and component solutions for a wide range of electronic products
Specialty packaging to prevent static and vibration. Material handling solutions to protect fragile products in the factory. Components engineered to maximize performance. These are the types of critical solutions UFP Technologies brings to the electronics industry.
Our team acts as an extension of our customers' in-house development, engineering and manufacturing groups, collaborating closely to solve your complex packaging and component challenges.
For our customers in the electronics industry UFP Technologies provides highly engineered foam and molded fiber protective packaging, protective cases, microphone windscreens, speaker components and many more.
We bring deep expertise in foams, conductive materials, thermoformed plastics, and laminated composites of films and fabrics. We specialize in creating innovative combinations of materials based on your specific needs, offering unrivaled protection against shock, vibration, ESD, abrasion, thermal damage, and more.
For our electronics customers, innovation takes many shapes. But each solution is shaped by a level of design, materials and process expertise that is unique to UFP Technologies.