Electronics Capabilities & Services

Shaping solutions that rise above the ordinary

Design and Engineering: Our engineers act as an extension of your in-house development, engineering and manufacturing groups, collaborating closely to solve your complex packaging and component challenges.

Fabrication: We are one of the largest foam fabricators in North America. We offer a range of fabrication capabilities including CNC routing, water-jet cutting, die-cutting and assembly, compression molding, laminating, and many more

Thermoforming: UFP Technologies has multiple manufacturing capabilities to thermoform plastics and foams for custom electronics packaging.

Certifications: ISO 9001; ISO 14001; materials that adhere to REACH for European and Asian compliance